The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Oct. 22, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Yuki Takemori, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 1/09 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/38 (2013.01); H05K 1/09 (2013.01); H05K 3/34 (2013.01); H05K 3/388 (2013.01); H05K 3/4644 (2013.01); B32B 2305/80 (2013.01); B32B 2457/08 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0338 (2013.01);
Abstract
A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer and a surface electrode on a surface of the electronic component body. The surface electrode includes a first sintered layer on the base ceramic layer, a second sintered layer on the first sintered layer, and a plating layer on the second sintered layer. A peripheral section of the first sintered layer has an exposed surface which is not overlaid with the second sintered layer or the plating layer.