The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jul. 20, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Mi Jeong Jeon, Suwon-si, KR;
Tae Hee Yoo, Suwon-si, KR;
Hyun Seok Yang, Suwon-si, KR;
In Jae Chung, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G03F 7/00 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); G03F 7/70466 (2013.01); H05K 1/0296 (2013.01); H05K 1/111 (2013.01); H05K 3/184 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.