The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Sep. 28, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Bongkyu Min, Suwon-si, KR;

Taewoo Kim, Suwon-si, KR;

Jinyong Park, Suwon-si, KR;

Hyelim Yun, Suwon-si, KR;

Hyeongju Lee, Suwon-si, KR;

Sanghoon Park, Suwon-si, KR;

Jiseon Han, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/528 (2006.01); H04M 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H01L 23/528 (2013.01); H04M 1/0277 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 2201/10378 (2013.01);
Abstract

The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.


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