The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Jul. 01, 2022
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Yahong Xiong, Taoyuan, TW;

Xiaodong Chen, Taoyuan, TW;

Wei Liu, Taoyuan, TW;

Litao Qian, Taoyuan, TW;

Shengli Lu, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/20254 (2013.01); H05K 7/2039 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01);
Abstract

A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.


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