The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Apr. 29, 2019
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jung Hun Oh, Seoul, KR;

Ki Cheol Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/40 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 33/405 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01);
Abstract

An embodiment discloses a semiconductor device package comprising: a substrate; an electrode disposed on the substrate; a semiconductor device and a protective device which are disposed on the electrode; a dummy electrode disposed on the substrate and spaced apart from the electrode along the edge of the substrate; a reflective member disposed on the dummy electrode and having an outer surface, an inner surface surrounding the semiconductor device and forming a cavity, and a bottom surface facing the substrate; and a light-transmitting member disposed on the reflective member and covering the cavity, wherein the inner surface includes a first surface adjacent to the substrate and a second surface extending from the first surface to the light-transmitting member and having a parabolic shape, and the bottom surface of the reflective member has a first recess disposed on the protective device between the dummy electrode and the inner surface.


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