The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jun. 23, 2022
Applicant:
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Inventors:
Mingzhu Wang, Ningbo, CN;
Bojie Zhao, Ningbo, CN;
Takehiko Tanaka, Ningbo, CN;
Zhongyu Luan, Ningbo, CN;
Zhenyu Chen, Ningbo, CN;
Zhen Huang, Ningbo, CN;
Assignee:
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 27/146 (2006.01); H04N 23/55 (2023.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 23/10 (2013.01); H01L 27/14621 (2013.01); H01L 27/14698 (2013.01); H04N 23/55 (2023.01); H05K 1/0274 (2013.01); H05K 1/118 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/16195 (2013.01);
Abstract
A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.