The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Nov. 02, 2021
Applicant:

Stmicroelectronics (Rousset) Sas, Rousset, FR;

Inventors:

Pascal Fornara, Pourrieres, FR;

Roberto Simola, Trets, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/70 (2006.01); H01L 27/01 (2006.01); H10B 41/41 (2023.01); H10B 41/42 (2023.01);
U.S. Cl.
CPC ...
H01L 27/016 (2013.01); H01L 21/707 (2013.01); H10B 41/41 (2023.02); H10B 41/42 (2023.02);
Abstract

An integrated circuit includes a semiconductor substrate, a conductive layer above a front face of the substrate, a first metal track in a first metal level, and a pre-metal dielectric region located between the conductive layer and the first metal level. A metal-insulator-metal-type capacitive structure is located in a trench within the pre-metal dielectric region. The capacitive structure includes a first metal layer electrically connected with the conductive layer, a second metal layer electrically connected with the first metal track, and a dielectric layer between the first metal layer and the second metal layer.


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