The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Jan. 22, 2019
Lumiense Photonics Inc., Vancouver, CA;
Robert Steven Hannebauer, Vancouver, CA;
Lumiense Photonics Inc., , CA;
Abstract
A method of interconnecting metallic structures in the manufacture of a three-dimensional semiconductor is provided, the method comprising providing a first upper surface of a first substrate and a second upper surface of a second substrate with a bonding layer; bonding the first upper surface to the second upper surface to provide a bond; etching a via through a lower surface of the first substrate, through the first substrate, around a first metallic structure embedded in the first substrate, through the bond and to a second metallic structure embedded in the second substrate; and filling the via with a conductive material to provide a via structure, thereby electrically connecting the metallic structures.