The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
May. 05, 2021
Applicant:
Materion Corporation, Mayfield Heights, OH (US);
Inventor:
Ramesh Kothandapani, Singapore, SG;
Assignee:
Materion Corporation, Mayfield Heights, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); B23K 1/00 (2006.01); B32B 3/06 (2006.01); B32B 3/26 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); B23K 1/00 (2013.01); B32B 3/06 (2013.01); B32B 3/266 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); C04B 37/026 (2013.01); B32B 2255/205 (2013.01); B32B 2439/00 (2013.01); B32B 2457/14 (2013.01); C04B 2237/125 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/408 (2013.01); C04B 2237/592 (2013.01); C04B 2237/708 (2013.01); C04B 2237/86 (2013.01); H01L 2924/16195 (2013.01);
Abstract
A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.