The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

May. 24, 2021
Applicant:

The Government of the United States of America, As Represented BY the Secretary of the Navy, Arlington, VA (US);

Inventors:

Travis J. Anderson, Alexandria, VA (US);

Marko J. Tadjer, Vienna, VA (US);

Karl D. Hobart, Alexandria, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); C30B 29/40 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/373 (2006.01); H01L 29/20 (2006.01); H01L 29/24 (2006.01); H01L 29/778 (2006.01); H01L 29/872 (2006.01); B29C 65/02 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7813 (2013.01); C30B 29/406 (2013.01); H01L 21/0242 (2013.01); H01L 21/0254 (2013.01); H01L 21/02568 (2013.01); H01L 21/4807 (2013.01); H01L 23/3732 (2013.01); H01L 29/2003 (2013.01); H01L 29/24 (2013.01); H01L 29/7786 (2013.01); H01L 29/872 (2013.01); B29C 65/02 (2013.01); B32B 43/006 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1911 (2015.01);
Abstract

Methods for obtaining a free-standing thick (>5 μm) epitaxial material layer or heterostructure stack and for transferring the thick epitaxial layer or stack to an arbitrary substrate. A thick epitaxial layer or heterostructure stack is formed on an engineered substrate, with a sacrificial layer disposed between the epitaxial layer and the engineered substrate. When the sacrificial layer is removed, the epitaxial layer becomes a thick freestanding layer that can be transferred to an arbitrary substrate, with the remaining engineered substrate being reusable for subsequent material layer growth. In an exemplary case, the material layer is a GaN layer and can be selectively bonded to an arbitrary substrate to selectively produce a Ga-polar or an N-polar GaN layer.


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