The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Oct. 24, 2019
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventor:
Andreas Plöβl, Regensburg, DE;
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25B 11/00 (2006.01); B29C 65/78 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B25B 11/00 (2013.01); B29C 65/7841 (2013.01); B29C 65/785 (2013.01); B29C 65/7852 (2013.01); H01L 21/67 (2013.01); H01L 21/67132 (2013.01); H05K 13/0408 (2013.01); H05K 13/041 (2018.08); H05K 13/0478 (2013.01); H01L 2224/7565 (2013.01);
Abstract
In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.