The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Mar. 03, 2020
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Yuki Isagawa, Kyoto, JP;

Kazuyoshi Nishikawa, Kyoto, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 9/04 (2006.01); H01H 36/00 (2006.01);
U.S. Cl.
CPC ...
H01H 9/04 (2013.01); H01H 36/00 (2013.01);
Abstract

An electronic apparatus includes, in a case, substrates with electronic components mounted thereon, a thermoplastic hot-melt resin, and a fluid branch member, wherein: the inside of the case is divided into a plurality of spaces; the plurality of spaces are at least any space among spaces between the case and the substrates and spaces between the substrates, and are filled with the thermoplastic hot-melt resin; and the fluid branch member is provided with an opening as an inlet for the thermoplastic hot-melt resin, and flow path parts for branching the thermoplastic hot-melt resin into multiple parts and guiding the same.


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