The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Mar. 15, 2023
Applicant:
Nec Corporation, Tokyo, JP;
Inventor:
Akira Hirokawa, Tokyo, JP;
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/12 (2022.01); A61B 5/1172 (2016.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G06V 40/1376 (2022.01); A61B 5/1172 (2013.01); G06T 7/00 (2013.01); G06V 40/1347 (2022.01); G06V 40/1359 (2022.01); G06V 40/1365 (2022.01);
Abstract
A fingerprint processing device includes a match processing unit configured to determine, based on a first degree, a plurality of feature points having a large value of the first degree among the feature points of a fingerprint specified in a fingerprint image of a matching source, the first degree representing a first distance to other feature points, as representative feature points used in match processing of the fingerprint.
Hirokawa, Akira. (2024). Fingerprint processing device, fingerprint processing method, program, and fingerprint processing circuit (U.S. Patent No. 12020503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12020503
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile