The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Apr. 11, 2023
Applicant:

Capital One Services, Llc, McLean, VA (US);

Inventors:

Daniel Herrington, New York, NY (US);

Suzanne Parker, Rhoadesville, VA (US);

Adrian Garner, Chesterfield, VA (US);

Lin Ni Lisa Cheng, Great Neck, NY (US);

Assignee:

CAPITAL ONE SERVICES, LLC, McLean, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0772 (2013.01); G06K 19/07722 (2013.01);
Abstract

Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.


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