The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

May. 26, 2022
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Hao-Yu Wang, Yokohama, JP;

Akinori Uchino, Yokohama, JP;

Atsushi Ohyama, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); B21D 5/16 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); B21D 5/16 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20409 (2013.01);
Abstract

A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.


Find Patent Forward Citations

Quick Actions:

Wang, Hao-Yu. (2024). Heat sink, cooling module, electronic apparatus, and method of manufacturing heat sink (U.S. Patent No. 12019486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12019486

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