The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Dec. 20, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kyoto University, Kyoto, JP;
The Ritsumeikan Trust, Kyoto, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
KYOTO UNIVERSITY, Kyoto, JP;
THE RITSUMEIKAN TRUST, Kyoto, JP;
Abstract
A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave from a sample including a bonding layer; an elastic wave reflection body configured to reflect the elastic wave generated from the sample; a sample installation unit provided between the elastic wave generation device and the elastic wave reflection body; an elastic wave detection device disposed in a direction in which the elastic wave is reflected by the elastic wave reflection body, and configured to detect the reflected elastic wave; and a control device configured to evaluate a parameter related to the bonding layer. The control device evaluates the parameter related to the bonding layer by comparing the actual value of the elastic wave detected by the elastic wave detection device with a theoretical value of the elastic wave calculated based on a theoretical model related to the sample.