The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Jan. 27, 2023
Applicant:

Metrospec Technology, L.l.c., Mendota Heights, MN (US);

Inventors:

Henry V. Holec, Mendota Heights, MN (US);

Brian Hillstrom, Rockford, MN (US);

Assignee:

Metrospec Technology, L.L.C., Mendota Heights, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F21V 29/74 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/74 (2015.01); F21Y 2115/10 (2016.08);
Abstract

Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.


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