The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Sep. 20, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Mark Saly, Santa Clara, CA (US);
Lakmal C. Kalutarage, San Jose, CA (US);
Jeffrey W. Anthis, San Jose, CA (US);
Tatsuya E. Sato, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/30 (2006.01); C23C 16/32 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C23F 1/44 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C23C 16/303 (2013.01); C23C 16/32 (2013.01); C23C 16/56 (2013.01); C23F 1/44 (2013.01); H01L 21/02274 (2013.01); H01L 21/76224 (2013.01); H01L 21/76837 (2013.01); C23C 16/45536 (2013.01); C23C 16/50 (2013.01);
Abstract
Methods for depositing film comprise depositing an aluminum-containing gap-fill film in a bottom-up manner in a feature of a substrate surface. The substrate can be sequentially exposed to an aluminum-containing precursor, a reactant, a fluorinating agent, and an etchant any number of times to promote bottom-up growth of the film in the feature.