The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Nov. 24, 2020
Applicants:

Kataoka Corporation, Kyoto, JP;

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Masami Suzuki, Kyoto, JP;

Norio Nishi, Kyoto, JP;

Junichi Matsumoto, Kyoto, JP;

Kimio Sumaru, Tsukuba, JP;

Toshiyuki Kanamori, Tsukuba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12M 1/34 (2006.01); C12M 1/00 (2006.01); C12M 1/12 (2006.01); C12M 1/26 (2006.01); C12M 1/32 (2006.01); C12M 1/42 (2006.01); C12N 1/00 (2006.01); C12N 1/02 (2006.01); C12N 5/00 (2006.01); C12N 13/00 (2006.01);
U.S. Cl.
CPC ...
C12M 1/42 (2013.01); C12M 1/005 (2013.01); C12M 1/3446 (2013.01); C12M 23/20 (2013.01); C12M 25/06 (2013.01); C12M 31/02 (2013.01); C12M 33/06 (2013.01); C12M 33/10 (2013.01); C12M 47/04 (2013.01); C12N 1/00 (2013.01); C12N 1/02 (2013.01); C12N 5/0081 (2013.01); C12N 13/00 (2013.01);
Abstract

A laser processing machine for killing specific cells from a group of cells on a surface of a layer containing an ingredient capable of absorbing laser light, the laser processing machine being configured to: control a laser light source to output laser light at 5W or less and at a wavelength of 380 nm or greater such that the laser light source is applied to a second area on a second surface of the layer opposed to the first surface; and control an actuator to provide a relative movement between the second area where the laser light is applied and the layer at a rate of 2000 mm/sec or less such that the irradiated second area absorbs energy to generate heat that kills unwanted cells on a first area of the first surface and the laser light does not instantly kill the specific cells on the first area upon irradiation.


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