The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Aug. 04, 2020
Applicant:

Nippon Electric Glass Co., Ltd., Shiga, JP;

Inventors:

Toru Shiragami, Otsu, JP;

Tatsuya Nagata, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 7/14 (2006.01); B32B 17/06 (2006.01); B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); C03C 27/10 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B32B 7/14 (2013.01); B32B 17/06 (2013.01); B32B 37/0046 (2013.01); B32B 37/10 (2013.01); B32B 37/1292 (2013.01); B32B 37/18 (2013.01); C03C 27/10 (2013.01); B32B 2315/08 (2013.01); H01L 21/52 (2013.01);
Abstract

Disclosed is a method for manufacturing a bonded body that includes a glass member, a bonding subject member, and a bonding portion bonded to the glass member and the bonding subject member. The method includes a setting step, a pressing step, and a bonding portion formation step. The setting step is a step of setting a jig main body lid on a jig main body in a state in which a stack is disposed in a recess of the jig main body. The pressing step is a step of adjusting an atmospheric pressure in the recess of the jig main body after the setting step to press the stack with the jig main body lid. The bonding portion formation step is a step of forming the bonding portion from a bonding material included in the stack in a state in which the stack is pressed in the pressing step.


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