The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Feb. 28, 2020
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Yuichi Yui, Tokyo, JP;
Akihiro Terasaka, Tokyo, JP;
Kenji Wada, Tokyo, JP;
Yoshifusa Tobata, Tokyo, JP;
Koichi Hasegawa, Tokyo, JP;
Yasunobu Ishida, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A fitting method is for fitting a material to be repaired and a repair patch to be adhesively bonded to the material at adhesive surfaces, each adhesive surface having at least two or more of curved portions. The fitting method includes measuring a shape of the material; measuring a shape of the repair patch; dividing repair patch shape measurement data acquired at measuring the shape of repair patch into pieces of divided data each including one or less of the curved portions; performing, at the adhesive surfaces, fitting processing of the pieces of divided data acquired at dividing the repair patch shape measurement data to material-to-be-repaired shape measurement data acquired at measuring the shape of material; and calculating a gap amount between the material-to-be-repaired shape measurement data and repair patch shape fitting data acquired from the fitting processing at the adhesive surfaces.