The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Apr. 29, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Jarrid A. Wittkopf, Palo Alto, CA (US);

Kristopher J. Erickson, Palo Alto, CA (US);

Lihua Zhao, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/22 (2006.01); B29C 64/112 (2017.01); B29C 64/165 (2017.01); B29C 70/88 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); H01C 17/065 (2006.01); B29C 35/08 (2006.01); B29K 105/16 (2006.01); B29K 505/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 70/882 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); H01C 17/06526 (2013.01); B29C 2035/0827 (2013.01); B29C 2795/005 (2013.01); B29K 2105/162 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0007 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3487 (2013.01);
Abstract

In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.


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