The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Feb. 03, 2023
Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute, JP;
Norio Fujitsuka, Nagakute, JP;
Keiichi Shimaoka, Nagakute, JP;
Teruhisa Akashi, Nagakute, JP;
Shota Harada, Nisshin, JP;
Yuuki Inagaki, Nisshin, JP;
Katsuaki Goto, Nisshin, JP;
Keitaro Ito, Nisshin, JP;
Takahiko Yoshida, Nisshin, JP;
KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, Nagakute, JP;
Abstract
A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.