The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Jan. 17, 2023
Applicant:

Lg Energy Solution, Ltd., Seoul, KR;

Inventors:

Tai Jin Jung, Daejeon, KR;

Hang June Choi, Daejeon, KR;

Kun Ha Park, Daejeon, KR;

Cha Hun Ku, Daejeon, KR;

Jung Kwan Pyo, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/20 (2006.01); B29C 33/00 (2006.01); B29C 33/06 (2006.01); B29C 35/08 (2006.01); B29C 51/08 (2006.01); B29C 51/14 (2006.01); B29C 51/26 (2006.01); B29C 70/88 (2006.01); B29D 99/00 (2010.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); H01M 50/116 (2021.01); H01M 50/136 (2021.01); B29K 23/00 (2006.01); B29K 67/00 (2006.01); B29K 77/00 (2006.01); B29L 31/34 (2006.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/129 (2021.01); H01M 50/131 (2021.01); H01M 50/14 (2021.01);
U.S. Cl.
CPC ...
B29C 51/20 (2013.01); B29C 33/0022 (2013.01); B29C 33/06 (2013.01); B29C 35/0805 (2013.01); B29C 51/08 (2013.01); B29C 51/14 (2013.01); B29C 51/265 (2013.01); B29C 70/885 (2013.01); B29D 99/006 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); H01M 50/116 (2021.01); H01M 50/136 (2021.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2067/003 (2013.01); B29K 2077/00 (2013.01); B29L 2031/3468 (2013.01); B29L 2031/3481 (2013.01); B32B 2250/24 (2013.01); B32B 2457/10 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/129 (2021.01); H01M 50/131 (2021.01); H01M 50/14 (2021.01);
Abstract

To solve the above problem, a pouch forming apparatus according to an embodiment of the present invention includes: a die in which a forming space is recessed inward from a top surface thereof; a partition wall partitioning the forming space into first and second forming spaces; a stripper disposed above the die and configured to descend to contact the die with the pouch film therebetween to fix the pouch film to be seated on a top surface of the die; and an electromagnetic force generation part disposed above the forming space and configured to generate electromagnetic force and configured to apply the electromagnetic force to the forming space.


Find Patent Forward Citations

Loading…