The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Aug. 07, 2019
Applicant:
National Research Council of Canada, Ottawa, CA;
Inventors:
Paul Arthur Trudeau, Gatineau, CA;
Arnold Jason Kell, Orleans, CA;
Xiangyang Liu, Nepean, CA;
Olga Mozenson, Nepean, CA;
Assignees:
NATIONAL RESEARCH COUNCIL OF CANADA, Ottawa, CA;
E2IP TECHNOLOGIES INC., Ottawa, CA;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B29B 11/06 (2006.01); B29C 44/12 (2006.01); B29C 44/42 (2006.01); B29C 45/14 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01); B29K 105/16 (2006.01); B29K 309/08 (2006.01); B29K 509/08 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); B29B 11/06 (2013.01); B29C 44/12 (2013.01); B29C 44/42 (2013.01); H05K 1/0313 (2013.01); H05K 3/0014 (2013.01); H05K 3/105 (2013.01); H05K 3/287 (2013.01); B29C 2795/002 (2013.01); B29K 2105/165 (2013.01); B29K 2309/08 (2013.01); B29K 2509/08 (2013.01); B29L 2031/3425 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1453 (2013.01);
Abstract
The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.