The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Mar. 27, 2019
Applicant:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Kayo Hashizume, Osaka, JP;
Masamichi Yamamoto, Osaka, JP;
Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/382 (2013.01); H05K 1/03 (2013.01); H05K 2201/032 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1131 (2013.01);
Abstract
A base material for a printed circuit board includes a base film having an insulating property, and a sintered body layer including metal particles and layered on at least one surface of the base film. The sintered body layer includes sintered particles that are derived from the metal particles and partially embedded into the surface of the base film. The embedment ratio of the sintered particles is greater than or equal to 10% and less than or equal to 90%.