The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Mar. 01, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Chan Jin Park, Suwon-si, KR;
Jong Eun Park, Suwon-si, KR;
Hyun Seok Yang, Suwon-si, KR;
Sangik Cho, Suwon-si, KR;
Hiroki Okada, Suwon-si, KR;
Young Ook Cho, Suwon-si, KR;
Mi Jeong Jeon, Suwon-si, KR;
In Jae Chung, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.