The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Aug. 31, 2021
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Min Young Hwang, Seoul, KR;
Byeong Kyun Choi, Seoul, KR;
Jin Seok Lee, Seoul, KR;
Moo Seong Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); H05K 1/09 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); H05K 2201/0959 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 μm to 5 μm.