The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Jul. 29, 2022
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventor:
Mitsuhiro Tanaka, Osaka, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 3/107 (2013.01); H05K 3/28 (2013.01); H05K 7/2039 (2013.01);
Abstract
An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.
Tanaka, Mitsuhiro. (2024). Electronic component and method for manufacturing electronic component (U.S. Patent No. 12016125). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12016125
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile