The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Mar. 17, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Naoya Murakita, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/552 (2006.01); H05K 3/28 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 23/552 (2013.01); H05K 3/284 (2013.01); H05K 9/0084 (2013.01); H05K 2201/10371 (2013.01);
Abstract

A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode.


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