The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jun. 22, 2022
Applicant:

Lapis Semiconductor Co., Ltd., Yokohama, JP;

Inventor:

Hiroji Akahori, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 21/00 (2006.01); H01Q 21/29 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0087 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/29 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/11 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip, a first antenna element and a second antenna element. The semiconductor chip includes a communication circuit. The first antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a first direction parallel to a first surface of the semiconductor chip. The second antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a second direction parallel to a second surface opposite to the first surface of the semiconductor chip.


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