The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jan. 07, 2020
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Dongyeon Kim, Gyeonggi-do, KR;

Seongjin Park, Gyeonggi-do, KR;

Sehyun Park, Gyeonggi-do, KR;

Sumin Yun, Gyeonggi-do, KR;

Myunghun Jeong, Gyeonggi-do, KR;

Jehun Jong, Gyeonggi-do, KR;

Jaehoon Jo, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 5/35 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 5/35 (2015.01);
Abstract

Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.


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