The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Sep. 03, 2019
Texas Instruments Incorporated, Dallas, TX (US);
Meysam Moallem, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes an integrated circuit die and an antenna substrate coupled to the integrated circuit die. The antenna substrate includes a conductor layer and a first dielectric layer disposed between the conductor layer and the integrated circuit die. The conductor layer includes antennas electrically coupled to the integrated circuit die. The integrated circuit package further includes an I/O substrate coupled to the integrated circuit die opposite the antenna substrate. In some such examples, the I/O substrate includes interconnect connectors and a second dielectric layer disposed between the interconnect connectors and the integrated circuit die. In some such examples, the integrated circuit package includes interconnect connectors extending between the antenna substrate and the I/O substrate.