The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Oct. 21, 2019
Applicants:

Sanyo Chemical Industries, Ltd., Kyoto, JP;

Gunze Limited, Kyoto, JP;

Inventors:

Ryosuke Kusano, Kyoto, JP;

Yasuhiro Tsudo, Kyoto, JP;

Yasuji Maruyama, Shiga, JP;

Kazuaki Onishi, Shiga, JP;

Yasuhiko Ohsawa, Kanagawa, JP;

Yuki Kusachi, Kanagawa, JP;

Hajime Satou, Kanagawa, JP;

Hiroshi Akama, Kanagawa, JP;

Hideaki Horie, Kanagawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/139 (2010.01); B29C 48/00 (2019.01); B29C 48/08 (2019.01); B29C 48/21 (2019.01); H01M 4/04 (2006.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01); B29K 505/08 (2006.01); B29L 31/34 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/139 (2013.01); B29C 48/001 (2019.02); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/21 (2019.02); H01M 4/04 (2013.01); H01M 4/667 (2013.01); H01M 4/668 (2013.01); H01M 10/0525 (2013.01); B29K 2505/08 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3468 (2013.01); H01M 2004/027 (2013.01);
Abstract

The present invention aims to provide a method for producing a pinhole-free thin resin current collector for negative electrodes. The method for producing a sheet-shaped resin current collector for negative electrodes of the present invention includes stacking three or more layers of melts of conductive resin compositions each containing a polyolefin and a conductive filler to obtain a multilayered body, wherein the polyolefin contained in each of the conductive resin compositions that form the respective layers of the multilayered body has a melt mass flow rate of 15 to 70 g/10 min as measured at a temperature of 230° C. and a load of 2.16 kg in accordance with JIS K7210-1:2014.


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