The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Oct. 03, 2022
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Kosuke Saeki, Tokyo, JP;
Shinya Yoneda, Tokyo, JP;
Jun Tanaka, Tokyo, JP;
Hiroaki Tamaki, Tokyo, JP;
Shinsuke Nagino, Tokyo, JP;
Naohiro Obonai, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer has a density of 0.880 g/cmto 0.895 g/cmand a melting point of 70° C. or higher, a skin layer has a density of 0.880 g/cmto 0.910 g/cmand a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layerin terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer in the whole resin component is 300 ppm to 2000 ppm.