The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Sep. 30, 2021
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

James J. Brogle, Merrimac, MA (US);

Timothy E. Boles, Tyngsboro, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/94 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/91 (2013.01); H01L 28/92 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01);
Abstract

A semiconductor device has a substrate and a first semiconductor layer with a high resistivity, such as an epitaxial layer with a resistivity in the range of 3000-5000 ohms/cm, formed over the substrate. A second semiconductor layer is formed at least partially in the first semiconductor layer. A capacitor is formed at least partially over the first semiconductor layer. The capacitor has a plurality of trenches extending through the first semiconductor layer and into the substrate, and a first insulating layer formed in the trench. The trenches can be parallel, serpentine, or other geometric shape. The capacitor also has a second insulating layer formed over the first insulating layer, and a polysilicon layer formed over the second insulating layer. A conductive layer is formed over the capacitor. The first semiconductor layer with high resistivity provides a vertical path to discharge high voltage events incident on the capacitor.


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