The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Jul. 16, 2021
Applicant:
Triple Win Technology(shenzhen) Co. Ltd., Shenzhen, CN;
Inventor:
Hsin-Yen Hsu, New Taipei, TW;
Assignee:
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/14603 (2013.01); H01L 27/14687 (2013.01); G06F 1/1686 (2013.01);
Abstract
A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.
Hsu, Hsin-Yen. (2024). Packaging structure, electronic device, and method for manufacturing the packaging structure (U.S. Patent No. 12015043). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12015043
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile