The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Aug. 16, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ju-Il Choi, Seongnam-si, KR;
Kwang-Jin Moon, Hwaseong-si, KR;
Byung-Lyul Park, Seoul, KR;
Jin-Ho An, Seoul, KR;
Atsushi Fujisaki, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a semiconductor device is provided. The method includes forming a preliminary via structure through a portion of a substrate; partially removing the substrate to expose a portion of the preliminary via structure; forming a protection layer structure on the substrate to cover the portion of the preliminary via structure that is exposed; partially etching the protection layer structure to form a protection layer pattern structure and to partially expose the preliminary via structure; wet etching the preliminary via structure to form a via structure; and forming a pad structure on the via structure to have a flat top surface.