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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12014968 B1

PDFFull Text
Date of Patent:
Jun. 18, 2024

Filed:

Nov. 22, 2022

Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus

Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Eiichirou Kishida, Kumamoto, JP;

Assignee:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Attorney:

Sheridan Ross PC

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 27/14 (2013.01); H01L 27/14687 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 2221/68327 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/005 (2013.01);
Abstract

To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.

Find Patent Forward Citations

Kishida, Eiichirou. (2024). Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus (U.S. Patent No. 12014968). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12014968

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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