The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jul. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jongchul Park, Seoul, KR;

Hyonwook Ra, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32568 (2013.01); H01J 37/32422 (2013.01); H01J 37/32715 (2013.01); H01J 37/32082 (2013.01); H01J 2237/2007 (2013.01); H01L 21/32136 (2013.01);
Abstract

A wafer processing apparatus is provided. The wafer processing apparatus includes a chamber body defining a plasma region configured that plasma is generated in the plasma region, a wafer support arranged in the chamber body and configured to support a wafer, first and second electrodes arranged between the wafer support and the plasma region and having apertures configured to guide a path of ions of the plasma, a first power source configured to apply, to the first electrode, a voltage that is higher than a voltage applied to the second electrode, and a second power source configured to apply, to the wafer support, a voltage that is higher than the voltage applied to the second electrode.


Find Patent Forward Citations

Loading…