The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jul. 13, 2021
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Akira Nishioka, Tokyo, JP;

Shuichi Nakagawa, Tokyo, JP;

Masaki Mizuochi, Tokyo, JP;

Takaaki Kikuchi, Tokyo, JP;

Masashi Fujita, Tokyo, JP;

Kenta Nomura, Tokyo, JP;

Naoya Ishigaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/26 (2006.01); H01J 37/34 (2006.01); H01L 21/677 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01J 37/261 (2013.01); H01J 37/3497 (2013.01); H01L 21/67739 (2013.01); H05K 7/20 (2013.01);
Abstract

A semiconductor processing apparatus according to the present invention includes a main body cover that covers a main body device and a control device. The main body cover has a transfer opening for transferring a semiconductor, and the main body cover further has an intake port that generates an air flow in a horizontal direction inside the main body cover.


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