The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Sep. 20, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); C23C 16/455 (2006.01); H01F 1/26 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); C23C 16/40 (2006.01); H01F 1/33 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/324 (2013.01); C23C 16/45555 (2013.01); H01F 1/147 (2013.01); H01F 1/26 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01); H01F 1/33 (2013.01); H01F 2017/048 (2013.01); H01F 41/0246 (2013.01);
Abstract
A coil electronic component includes a body including an insulator; a coil portion embedded in the body; aggregates dispersed in the insulator, where the aggregates each comprise a plurality of magnetic particles, coating layers formed on surfaces of the aggregates using an insulating material, and external electrodes connected to the coil portion.