The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

May. 10, 2021
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Junichi Nishimura, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/20 (2006.01); H01B 1/22 (2006.01); H01B 5/16 (2006.01); H01B 13/34 (2006.01); H01L 23/00 (2006.01); H01R 4/04 (2006.01); H01R 11/01 (2006.01); H01R 43/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); H01B 5/16 (2013.01); H01B 13/34 (2013.01); H01L 24/83 (2013.01); H01R 4/04 (2013.01); H01R 11/01 (2013.01); H01R 43/00 (2013.01);
Abstract

Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.


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