The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Jul. 22, 2022
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/20 (2006.01); H01L 23/495 (2006.01); H10N 52/00 (2023.01); H10N 52/80 (2023.01); H10B 61/00 (2023.01); H10N 59/00 (2023.01);
U.S. Cl.
CPC ...
G01R 15/207 (2013.01); G01R 15/202 (2013.01); H01L 23/49586 (2013.01); H10N 52/00 (2023.02); H10N 52/80 (2023.02); H10B 61/00 (2023.02); H10N 59/00 (2023.02);
Abstract
In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.