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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12012764 B1

PDFFull Text
Date of Patent:
Jun. 18, 2024

Filed:

Jan. 18, 2023

Floor panel

Applicant:

Flooring Industries Limited, Sarl, Bertrange, LU;

Inventors:

Laurent Meersseman, Mont de l'Enclus, BE;

Martin Segaert, Ypres, BE;

Assignee:

UNILIN BV, Wielsbeke, BE;

Attorney:

Workman Nydegger

Primary Examiner:

Michael A Tolin

Assistant Examiner:

Hana C Page

Int. Cl.
CPC ...
B29C 48/21 (2019.01); B32B 3/06 (2006.01); B32B 3/12 (2006.01); B32B 5/14 (2006.01); B32B 5/18 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 21/02 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/40 (2006.01); B32B 37/06 (2006.01); B32B 37/15 (2006.01); B32B 37/16 (2006.01); B32B 37/22 (2006.01); B44C 1/24 (2006.01); B44C 5/04 (2006.01); E04F 15/02 (2006.01); E04F 15/10 (2006.01); E04F 15/18 (2006.01); B29C 48/17 (2019.01); B29C 48/19 (2019.01); B29C 65/00 (2006.01); B29C 65/56 (2006.01); B29C 65/72 (2006.01); B29C 65/78 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
E04F 15/02038 (2013.01); B29C 48/21 (2019.02); B32B 3/06 (2013.01); B32B 3/12 (2013.01); B32B 5/145 (2013.01); B32B 5/18 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 21/02 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/40 (2013.01); B32B 37/06 (2013.01); B32B 37/153 (2013.01); B32B 37/16 (2013.01); B32B 37/226 (2013.01); B44C 1/24 (2013.01); B44C 5/04 (2013.01); E04F 15/02194 (2013.01); E04F 15/10 (2013.01); E04F 15/102 (2013.01); E04F 15/105 (2013.01); E04F 15/107 (2013.01); E04F 15/18 (2013.01); B29C 48/175 (2019.02); B29C 48/19 (2019.02); B29C 65/56 (2013.01); B29C 65/72 (2013.01); B29C 65/7861 (2013.01); B29C 66/45 (2013.01); B29C 2793/0072 (2013.01); B32B 38/145 (2013.01); B32B 2266/0235 (2013.01); B32B 2266/08 (2013.01); B32B 2307/412 (2013.01); B32B 2307/414 (2013.01); B32B 2307/72 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2309/105 (2013.01); B32B 2309/12 (2013.01); B32B 2310/0825 (2013.01); B32B 2327/06 (2013.01); B32B 2419/04 (2013.01); B32B 2451/00 (2013.01); B32B 2471/00 (2013.01); E04F 2201/0107 (2013.01); E04F 2201/023 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1039 (2015.01); Y10T 156/1084 (2015.01);
Abstract

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.

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