The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Oct. 25, 2021
Applicant:

Abc Technologies Inc., Toronto, CA;

Inventor:

Mosen Sepasi, Mississauga, CA;

Assignee:

ABC TECHNOLOGIES INC., Toronto, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60R 13/02 (2006.01); B29C 51/02 (2006.01); B29C 51/08 (2006.01); B29C 51/26 (2006.01); B29C 51/14 (2006.01); B29K 311/10 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B60R 13/02 (2013.01); B29C 51/02 (2013.01); B29C 51/082 (2013.01); B29C 51/266 (2013.01); B29C 51/145 (2013.01); B29C 2791/001 (2013.01); B29C 2793/009 (2013.01); B29K 2311/10 (2013.01); B29L 2031/3008 (2013.01); B29L 2031/3014 (2013.01); B29L 2031/302 (2013.01); B29L 2031/3041 (2013.01);
Abstract

A thermoformed article is disclosed that includes a self-supporting structural base layer, a covering applied to a first side of the base layer, and one or more secondary features co-injected upon a second side of the base layer. The covering and the secondary features of the thermoformed article are applied to the base layer during the same molding operation. Also disclosed is a process for forming a thermoformed article that includes placing a covering in a mold tool as a first layer, placing a self-supporting structural base layer in the mold tooling as a second layer, closing the mold tooling with the covering and base layer, and co-injecting upon a side of the base layer opposite to the covering one or more secondary features.


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