The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Nov. 28, 2023
Applicant:

Nanjing University of Aeronautics and Astronautics, Nanjing, CN;

Inventors:

Congze Fan, Nanjing, CN;

Wenzhe Song, Nanjing, CN;

Zhongde Shan, Nanjing, CN;

Yiwei Chen, Nanjing, CN;

Jinghua Zheng, Nanjing, CN;

Yaxing Song, Nanjing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 15/00 (2011.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); G06F 30/10 (2020.01); G06F 113/10 (2020.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 50/02 (2014.12); G06F 30/10 (2020.01); G06F 2113/10 (2020.01);
Abstract

A path planning method based on dynamic contour offset discretization and for spatial curved-surface printing is provided. Firstly, transversal equal slicing is carried out on a target model, and single/double contours are labeled; secondly, central slicing is carried out on the model, curvature contours are discretized, feature values of contour offsets of slice layers are calculated on the basis of a surface contour curvature of the model, and dynamic offset filling for inner contours of horizontal slices is realized; then longitudinal equal slicing is carried out on the slices, and spatial discrete points of the target model are obtained; and finally, virtual double contours are constructed for the single contours, and labeling processing for the discrete points is carried out, so that a discretized three-dimensional spatial equidistant lattice of the target model is obtained.


Find Patent Forward Citations

Loading…