The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Nov. 19, 2021
Nakagawa Sangyo Co., Ltd., Inuyama, JP;
Hiroshige Nakagawa, Inuyama, JP;
Noriaki Nakagawa, Inuyama, JP;
NAKAGAWA SANGYO CO., LTD., Inuyama, JP;
Abstract
A die for molding a reinforcing bar, which enables the production of a reinforcing bar having sufficient strength in a convenient and inexpensive manner, includes: a main flow channel (F), formed in a central portion of a main body, that receives a molten thermoplastic polymer material (Rt) output from an extruder (); at least one first sub flow channel (F), formed in an outer peripheral portion of the main body, that receives the molten thermoplastic polymer material (Rt) and fluidly connects with an outer peripheral portion in the main flow channel (F); and at least one second sub flow channel (F) configured to receive reinforcing fibers () and fluidly connected with the main flow channel Fupstream of a junction position of the main flow channel Fand the at least one first sub flow channel (F).