The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Jun. 24, 2019
Applicant:

Black & Decker Inc., New Britain, CT (US);

Inventors:

Joshua M. Lewis, Baltimore, MD (US);

Michael D. Grove, Windsor, PA (US);

Assignee:

Black & Decker Inc., New Britain, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 7/14 (2006.01); B25B 21/02 (2006.01); B25F 5/02 (2006.01); H01H 9/54 (2006.01); H01H 13/14 (2006.01); H01H 13/52 (2006.01); H01H 21/24 (2006.01); H02K 11/30 (2016.01); H02K 11/33 (2016.01); H02K 23/18 (2006.01); H02M 7/48 (2007.01); H02P 6/14 (2016.01); H02P 6/16 (2016.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B25B 21/02 (2013.01); B25F 5/02 (2013.01); H01H 9/54 (2013.01); H01H 13/14 (2013.01); H01H 13/52 (2013.01); H01H 21/24 (2013.01); H02K 7/145 (2013.01); H02K 11/33 (2016.01); H02K 23/18 (2013.01); H02M 7/48 (2013.01); H02P 6/14 (2013.01); H02P 6/16 (2013.01); H05K 1/0206 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01); H05K 7/2039 (2013.01); H01H 2013/525 (2013.01); H01H 2231/048 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10545 (2013.01);
Abstract

An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.


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