The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Sep. 17, 2020
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Wei Shi, San Jose, CA (US);
Adar Magen, Sunnyvale, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 23/57 (2023.01); H01L 27/146 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/60 (2023.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H04N 23/54 (2023.01); H04N 23/60 (2023.01); H04N 23/55 (2023.01);
Abstract
An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.